(EnergyIndustry.Net, April 23, 2019 ) Global Redistribution Layer Material Market Analysis to 2027 is a specialized and in-depth study of the Redistribution Layer Material industry with a focus on the global market trend. The report aims to provide an overview of global Redistribution Layer Material market with detailed market segmentation by product/application and geography. The global Redistribution Layer Material market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the Redistribution Layer Material players and offers key trends and opportunities in the market. The global redistribution layer material market accounted to US$ 105.4 Mn in 2018 and is expected to grow at a CAGR of 25.7% during the forecast period 2019 - 2027, to account to US$ 794.5 Mn by 2027.
leading Redistribution Layer Material Market Players: Advanced Semiconductor Engineering, Inc. (ASE group), Amkor Technology, Inc., Fujifilm Holdings Corporation, Hitachi Chemical DuPont MicroSystems L.L.C., Infineon Technologies AG, Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET), NXP Semiconductors N.V., Samsung Electronics Co. Ltd, Shin-Etsu Chemical Co., Ltd., SK HYNIX INC., Sumitomo Bakelite Co., Ltd, The Dow Chemical Company, Toray Industries, Inc., Taiwan Semiconductor Manufacturing Company Ltd.
Market Insights:
Growing trends of miniaturization of consumer electronic devices to create more demands for Redistribution layer material: Manufacturing of consumer electronics, healthcare related products, automobiles, and defense industries are some of the prominent industry verticals that have been prolific in the automation integrations into the manufacturing assembly lines. Automation integration requires additional functionalities to be added on the chips for translating the manual operations to automated ones. Increasing the functionalities on chips while maintaining the size of the chip is made possible with the help of redistribution layer material and therefore, these manufacturing sectors are anticipated to drive the demands for redistribution layer material drastically during the forecast period.
Proliferation of IoT and connected devices across industry verticals to create further more opportunities: The advent of IoT has enabled each device to be connected over the internet and the rising adoptions globally would result in more than billions of devices connected over the internet. Also, validating to the above mentioned point is the fact that the data traffic rate on a global level, has grown at an annual rate of more than 65% over the last five years. Also, between 2018 and 2023, the data traffic is anticipated to grow at a compound annual growth rate of close to 40 percent. This exponential growth in data traffic over the internet is out rightly attributed to the growing penetration of smartphones and other consumer electronic devices that can be connected over the internet as a result of the growing popularity of IoT.
Material Insights The global redistribution layer material market by material was led by polyimide segment. The other materials for redistribution layer material market include FEpoxy (phenol & acrylates based), metal and Silicones. A polymer material is required for redistribution layer in the advanced packaging techniques that catalyzes in routing the connection between the solder bumps and the I/O pads. The materials used for redistribution are used as passivation layer for bumping and stress buffers. There are a certain set of physical characteristics required in the dielectric material used for RDL in the advanced packaging applications that include low cure temperature, low dielectric constant, higher chemical and mechanical stabilities.
Application Insights The redistribution layer material market by end use is segmented into Fan-Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging. Advanced packaging techniques integrate multiple die in a single package and thereby ensure in reducing the device footprint. Also, integrating multiple-die in a single package ensures, multiple functionalities of the device in a small form factor. The majorly used advanced packaging techniques have been broadly categorized under two segments namely Fan-out Wafer Level Packaging (FOWLP) and 2.5D/3D IC packaging. Redistribution layers find their applications in these advanced level packaging where they are placed for resolving issues related to heat dissipation, elongation of battery life, and enhancement of the performance.
Also, key Redistribution Layer Material market players influencing the market are profiled in the study along with their SWOT analysis and market strategies. The report also focuses on leading industry players with information such as company profiles, products and services offered, financial information of last 3 years, key development in past five years.
Table of Contents 1. Introduction 2. Global Redistribution Layer Material Market – Key Takeaways 3. Global Redistribution Layer Material Market – Market Landscape 4. Global Redistribution Layer Material Market – Key Market Dynamics 5. Global Redistribution Layer Material Market –Analysis 6. Redistribution Layer Material Market –Global Regulatory Scenario 7. Global Redistribution Layer Material Market Analysis– By Product 8. Global Redistribution Layer Material Market Analysis– By Application 9. Global Redistribution Layer Material Market Analysis– By End User 10. North America Redistribution Layer Material Market Revenue and Forecasts to 2027 11. Europe Redistribution Layer Material Market Revenue and Forecasts to 2027 12. Asia Pacific Redistribution Layer Material Market Revenue and Forecasts to 2027 13. Middle East and Africa Redistribution Layer Material Market Revenue and Forecasts to 2027 14. South and Central America Redistribution Layer Material Market Revenue and Forecasts to 2027 15. Redistribution Layer Material Market –Industry Landscape 16. Redistribution Layer Material Market –Key Company Profiles 17. Appendix Purchase This Report @ http://bit.ly/2VR1L4l